Advancing Microelectronics Magazine - International Microelectronics and Packaging Society
Novel Porous Materials Developed for Microelectronics Thermal Management Highlighted on Front Cover of Journal of Materials Chemistry C – Toronto Smart Materials & Structures (TSMART)
Microelectronics Journal | ScienceDirect.com by Elsevier
Microelectronics Journal
Dr. Chithraja Rajan on LinkedIn: #rcoem #microelectronics